yroByte
Bring the board to life.
Rail-by-rail bring-up, peripheral checks, and firmware developed against the same schematic. Bench observations feed back into the design.
All services
- MVP Development A first version that ships
- Full Product Development App, backend, admin, ops
- Scaling & Platform Performance under load
- Web App Development Product-grade web apps
- Mobile App Development iOS and Android, one codebase
- Desktop Development Windows, macOS, and Linux
- API & Backend Systems Integrations and production APIs
- Shipping Platforms Carrier APIs and multi-carrier platforms
- Admin Dashboards Consoles a team works from
- Ecommerce Solutions Stores, payments, and orders
- AI Platform Mission Control for your team
Studio & specialized
- Game Development iOS, Android, web, desktop
- 2D Assets & Animation Sprites, UI, and cutscenes
- 3D Assets & Animation Characters, props, cinematics
- Embedded Hardware Boards, firmware, manufacturing
- Robotics & Autonomy Perception, planning, control
- Scientific & Biomedical Instrument-adjacent software
- Aerospace & Simulation Enterprise programs only
- Realtime Communication Game servers, WebRTC, UDP/TCP
- AI Tracking People, plates, pulse — live cameras
- Security Communications 4G PTT, command, personnel
- End-to-End Encryption Your keys, Signal-class sessions
- Consultation Scope, architecture, a plan
- Asset Design 2D and 3D under one roof
Embedded hardware & firmware
The board. The BOM. The factory file.
Hybrid circuit boards: mixed-signal, shimmer flex, foldable rigid-flex, mixed-laminate RF, 10-layer HDI. Designed in Altium, brought up on the bench, handed to any CM as Gerbers they can actually build.
Starting $10,000 CAD — a complete test PCB, size and complexity capped below.
01 / ENGINEERED AS ONE
Small boards.
Whole systems.
The shape, the signals, the software. We bring them together around the product you want to build, from the first schematic to the factory files.
ZYROBYTE / BOARD STUDIESREV. 01
SIGNAL / POWER / CONTROLCONCEPT VISUAL
4–6 layer typical
Two domains. One considered design.
Bring analog sensing and digital processing onto the same board. Plan the power, signal paths, and layout together, around what your product needs to measure and control.
- Analog front-end & digital core
- Power and grounding strategy
- Firmware aligned with the schematic
APPLICATION SPACES
Explore this engagement Sensor platforms / Instrumentation / Connected devices
The right material, in the right place.
Hybrid can mean a flexible connection, a mixed-material stackup, or an RF region alongside a digital core. We start with the product’s constraints and agree the construction with the fabricator.
02 / THE BOARD IS ONLY THE BEGINNING
Hardware and firmware.
On the same wavelength.
A circuit and its code belong in the same conversation. We connect schematic decisions to behavior you can observe on the bench.
FROM SCHEMATIC TO FIRST SIGNALTHE BRING-UP BENCHMeasure. Understand.
Iterate.
Iterate.
Build for the operating environment.
Bare-metal, FreeRTOS, Zephyr, or embedded Linux. We scope the runtime, interfaces, and power behavior around the device.
Plan for what happens after shipping.
Diagnostics, defensive parsing, and update workflows with staged rollout and rollback, where the product requires them.
C / C++ / RUSTBARE-METAL → RTOS → LINUX
03 / A CLEAR PLACE TO START
Your first board.
Your next product.
Explore the existing engagement scopes below. Starting prices are in CAD; final scope and schedule are confirmed around your design.
Package 01FIRST CUSTOM BOARD
Test PCB
from $10,000 CAD
The entire first custom board: schematic, layout, BOM, fab files, and a short assembled run — brought up on the bench.
SIZE / ENVELOPE≤ 100 × 80 mm
INDICATIVE TIMELINE2–4 weeks
- Altium schematic + PCB
- Stackup & DRC to IPC Class 2
- Full BOM with MPNs, AVL, lifecycle flags
- Gerber X2, NC drill, ODB++ or IPC-2581
- Pick-and-place + paste stencil data
- 5 assembled ENIG prototypes
- Rail-by-rail bring-up notes
- Two revision rounds
01
Starting design engagements, with the size and complexity limits shown. Fabrication of exotic stackups is quoted with the fab. You own every file.
04 / FROM BENCH TO BUILD
A clear path.
At every stage.
Start with a prototype or bring an existing design. We agree the next milestone and what you need to review before moving forward.
- 01
Prove the idea
Dev boards, modules, and a focused prototype establish the core behavior.
Prototype & requirements - 02
Design & bring up
Schematic, layout, fabrication, and first-board checks connect the design to working hardware.
Custom boards & bench findings - 03
Validate & prepare
Functional tests, the certification path, component sourcing, and a pilot build prepare the next step.
Validation & manufacturing review - 04
Integrate & produce
Enclosure coordination, tooling, test fixtures, and assembly planning support the production ramp.
Production handoff
THE BOARD AND THE ENCLOSURE
Make the fit part of the plan.
Board STEP data meets enclosure CAD before tooling is cut. We coordinate manufacturability reviews and tooling quotes with the mold maker, based on the actual part.
05 / BUILT TO BE YOURS
Your design.
Your files.
Your next move.
A handoff your team can understand and your manufacturing partner can work with. Editable sources and production outputs, with scope agreed up front.
A BOM that travels with the design.
Manufacturer part numbers, quantities, footprints, lifecycle flags, and approved alternatives where applicable. Your purchasing team gets the context behind the components.
THE MANUFACTURING HANDOFF06
Editable design sourceALTIUM
Schematic, PCB, and output-job files for future revisions.
Fabrication packageGERBER / NC DRILL
Copper, mask, silkscreen, paste, board outline, and drill data.
Intelligent manufacturing dataODB++ / IPC-2581
Stackup, netlist, and assembly data in the format agreed with the fabricator.
Assembly placementCENTROID CSV
Component position, rotation, and board side for assembly setup.
Electrical test netlistIPC-D-356
The design reference for bare-board electrical testing.
Mechanical integration3D STEP
Board and component geometry for enclosure coordination.
Yes. A prototype using development boards and off-the-shelf modules can help establish the core behavior before a custom design. Tell us what you need to prove, and we will scope that first step.
We start with the product envelope, signals, power requirements, and manufacturing constraints. A standard rigid board may be enough; flex, rigid-flex, mixed-material, or HDI construction can be explored when the requirements call for it.
Each package lists its starting design price, size or construction limits, indicative timeline, and included outputs. The Test PCB package includes five assembled ENIG prototypes. Fabrication for exotic stackups is quoted with the fabricator. Final scope and schedule are confirmed for your project.
Yes. We can scope hardware design, board bring-up, and firmware together. The package inclusions describe the starting scope; the full firmware requirements, runtime, interfaces, and update needs are agreed separately as part of the proposal.
You own the project files delivered under the engagement. The handoff is scoped to include editable design sources and manufacturing outputs so your team can revise the design and work with a suitable manufacturing partner.
We establish the validation and certification path for the target market and coordinate manufacturing and enclosure requirements. External testing, specialist fabrication, and mold tooling are scoped and quoted for the actual product.
Ready for a hybrid stack?
Bring the product you have been carrying around
Tell us the envelope — fold, RF, analog, HDI. We will map it to a class and a starting rate, then propose the engagement.